| Layer count | 2-30 Layers |
| Min outer line width/space | 2/2mil |
| Outer copper thickness | 210um(6OZ) |
| Inner copper thickness | 210um(6OZ) |
| Tolerance of PCB thickness | board thickness≤1.0mm; ±0.1mm,+/-0.05mm below 4 layers board thickness＞1.0mm; ±10% |
| Minimum PTH | Mechanical hole 4mil, laser 3mil |
| Material | FR-4 ,High Tg ,Halogen-free ,PTFE ,Rogers,Polyimide |
| HDI | Levels 1-6 |
| Special Process | Buried blind vias, blind slots, rigid-flex combination,mixed pressure, back drilling, buried resistance,buriedcapacitance, milling steps, multi-combination impedance; |
| SMT capacity | 20 million solder joints/day |
| SMT production line | 9 |
| Surplus | Resistance and capacitance: 0.3%，IC: 0% |
| Board type | POP/PCB/FPC/Rigid-flex board/Metal-PCB |
| Mounting component precision | Minimum package: 03015CHIP/0.20PLT Minimum Component Accuracy:±0.034MM IC placement accuracy: ± 0.025MM |
| PCB size | 50*50MM~774*710MM |
| PCB thickness | 0.3~6.5MM |
